Thermal Adhesive Tape Vs Paste

Arctic silver as5 thermal paste vs bergquist bond ply 100 thermal tape experimental concept.

Thermal adhesive tape vs paste.

In plain english i m asking which thermal material moves heat more efficiently by. So is thermal compound thermal goop thermal gunk heat paste that gooey stuff you put between your cpu and heat sink hot ass gloop a doop. Arctic silver adhesive thermal conductivity is advertised as 7 5 w m k. Once thermal adhesive paste cures.

Ceramique compound thermal conductance is advertised as 200000 w m 2 c for an 0 001 inch thick layer. The key for me was to compare the two materials on the relative performance of thermal transfer not the absolute performance in terms of lumens. It makes the processor look brand new again and takes 1 4 of the time. Adhesive pastes have better thermal properties than pads but they are accompanied by a significant drawback.

The tape will do fine but wont get you the maximuim overclock or the coolest temps to get the paste tape of the processor and clean it you can use alcohol and that works good but i always been a firm believer of arctic clean thermal material remover witch works wonders. There is no stated thermal conductivity or conductance data for arctic alumina adhesive. Yeah for the processor i always use thermal paste. That calculates to 5 08 w m k thermal conductivity.