Thermal Epoxy Heat Sink

These highly effective thermal interface materials contain special alumina boron nitride silica aluminum nitride fillers or particles to improve device reliability and longevity.

Thermal epoxy heat sink.

This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and led lighting thermal management. Serviceable from 4k to 400 f. 3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications.

Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. Henkel thermal adhesives create a mechanical attachment of a component to a heat sink with thermal transfer properties and without the need for additional fasteners. These customizable liquid tapes pads or a mix means reliable high thermal performance less waste and just in time supply.

The liqui bond product line also offers mild elastic properties which assist in relieving cte mismatches. This thixotropic adhesive provides high temperature bonds to a variety of substrates. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance. One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling.

50 3186 nc is a two part thermally conductive epoxy adhesive.