Thermal Interface Material Grease

To learn more about henkel s line of thermal grease alternatives click here. Aoki r and chiu c p a testing apparatus for thermal interface materials proceedings of 1998 international symposium on microelectronics san. As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and.

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They exhibit outstanding thermal conductivity because they fit snugly in the gap between the heat generating.

Thermal interface material grease.

An integrated circuit and a heat dissipating device e g. A thermal interface material shortened to tim is any material that is inserted between two components in order to enhance the thermal coupling between them a common use is heat dissipation in which the tim is inserted between a heat producing device e g. And matayabas j thermal contact resistance of cured gel polymeric thermal interface material submitted to ieee transactions on components and packaging technology 2003. Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.

Henkel s hi flow phase change materials are not only an effective alternative for thermal greases their thixotropic characteristics ensure they are solid at room temperature and won t flow out of an interface at operational temperature. That s why thermal interface materials are becoming such an important technology in the electronics industry. Silicone based thermal interface materials are compound materials which contain a high ratio of thermally conductive fillers.

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