As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and.
Thermal interface material thickness.
One microprocessor supplier recommends only two thermal interface materials for interfacing its latest product with a heat sink and both are recently developed greases 2.
65 products found filter applied thickness 1mm.
It is also helpful for die cast heat sinks with poor planarity.
Thermal interface materials tims for example thermal conductive gap filling materials are widely used in electronic packaging to reduce the thermal contact resistance caused by the interfacial air whose volume content and thermal conductivity k can be as high as 99 and as low as 0 026 w m 1 k 1 respectively.
Hsmf is a compressible thermal interface materials made of a non silicone based polymer.
While a thermal resistance value quoted for a specific tim part number quite predictably refers to the thickness of that.
It is ideal for large area thermal interface requirements such as igbts which can benefit from the 0 010 thickness.
Thermal interface materials 65 thermal insulators 15 thermally conductive materials 19 thermal pads.
Polymerized silicone rubbers in the form of easy to handle solids.