Thermally Conductive Epoxy High Temperature

Idea for joining dissimilar substrates.

Thermally conductive epoxy high temperature.

Subsequently it can be applied in sections as thin as 5 15 microns. Aremco bond 805 is a two component 100 solids aluminum filled epoxy ideal for bonding potting and tooling applications to 300 ºc 572 ºf. Thermo bond 180 is designed for the fastest and most continuous high heat transfer. Omegabond 100 two part epoxy.

Good to 105 c 221 f omegabond 200 two part epoxy. Thermo bond 100 is designed for the fastest and most continuous high heat transfer. Duralco 132 500 f aluminum filled epoxy. Very high thermal conductivity.

Good to 130 c 265 f omegabond 101two part epoxy. Resist oils solvents most acids. Thermally conductive epoxy adhesive black alumina filled casting low exotherm. Serviceable from 100 f to 400 f.

Master bond ep30tc is a multifaceted epoxy for use in thermal management applications. Two part room temperature curable epoxy system with high thermal conductivity. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance. Aremco bond 805 a new high temperature thermally conductive epoxy system developed by aremco products inc is now for bonding potting and molding applications to 300 ºc 572 ºf.

Thermal adhesive tape 20mm by 25m hpfix high performance thermally conductive tape apply for coolers heat sink led strips computer cpu gpu easy to apply high durability 4 4 out of 5 stars 101 12 99 12. Thermally conductive electrically insulating heat cure epoxy high temperature resistance. Aluminum metal filled epoxy that cures at room temp to form machinable thermally conductive bond lines. Duralco 132 offers the maximum conductivity available in a 500ºf epoxy system.

Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity. Sets at room temp. This thixotropic adhesive provides high temperature bonds to a variety of substrates. Will cure at room temperature.

Features exceptional thermal conductivity. When used as an adhesive the thermally conductive filler has very fine particle sizes. It is a specialty formulation that can be used for bonding coating sealing and encapsulation. Can be supplied as a non sag putty for heat tracing applications.

Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity. Sets at room temp.